Circular plasma beam source for multifunctional use in various types of systems.
The font design is highly scalable and can be adapted to the hardware, being also the most favorable physical and mechanical point of view.
The QuatroN-R can be used for corrosion (etching), coating, support for steam deposition (PVD) or magnetron, and oxide layers generation.
Customizable circular plasma source
Mechanically advantageous design for flexible integration into different systems.
Wide range of applications
Suitable for etching processes, PVD support, IBS, oxide formation and direct coatings (eg DLC).
Process stability with high ionic energy
Range of 20–1500 EV, neutral beam and parallel without static charge. possibility of high current densities according to energy.
Multi-gas operation
All process gases can be used; The mixture occurs within the source for maximum reactivity.
